Qualcomm Tech Summit is scheduled to start from 1st December and the company will be announcing its next-generation flagship smartphone chipset — Qualcomm Snapdragon 875. Now, just weeks before the official announcement, details about the upcoming SoC have been leaked online.
A new report coming from China claims that the Snapdragon 875 will be manufactured using a 5nm node. It’s noteworthy that this is not new information as it had already been revealed earlier. Also, it won’t be the first chipset to be made using the 5nm process as Apple A14 Bionic and Huawei HiSilicon Kirin 9000 have already been launched.
The report reveals that the upcoming octa-core chipset will come with one oversized core clocked at 2.84GHz, three Cortex-A78 cores clocked at 2.42GHz, and four Cortex-A55 cores which are clocked at 1.8GHz. It is also said to pack Adreno 660 GPU for enhanced graphics performance.
Previously, it was reported that for the SD875 chipset, Qualcomm is opting for an “oversized” core which is Cortex-X1 that is claimed to offer 23 percent improvements in terms of performance than the Cortex-A78.
As for the connectivity support, the SoC is expected to come with Snapdragon X60 5G modem but it remains to be seen if the company opts to make it an integrated modem, similar to what it did with its predecessor.
Just a couple of days ago, a prototype device powered by the Qualcomm SD875 SoC was spotted on the AnTuTu benchmarking platform, revealing that the chipset scored 899,401 points with a CPU score of 333,246 points and a GPU score of 342,225 points.
Qualcomm Snapdragon, AnTuTu, HiSilicon
World news – CA – Qualcomm Snapdragon 875 details leak online weeks ahead of launch – Gizmochina