Apple is expected to accelerate the adoption of LCP (liquid crystal polymer)-based flexible PCBs for the antenna modules to be used by its future iPhone lineup supporting 5G mmWave technology, according to industry sources.
Apple will use more LCP antenna modules instead of current mainstream of MPI (modified polyimide)-based models as the former ones perform better than the latter for high-speed data transmission, said the sources.
Besides, since the US market is focusing on the development of mmWave technology, Apple also intends to sustain a leading market position in this market segment, added the sources.
While Japan’s Murata Manufacturing currently dominates in the LCP antenna module segment, Taiwan-based Flexium Interconnect has also achieved major breakthroughs recently in the production of adhesiveless LCP flexible PCBs, making it a potential contender for related orders from Apple in the coming year, said the sources.
Fellow company Career Technology has also been keen on developing LCP technology, but it remains to be seen how far it could go to meet Apple’s requirements, add the sources.
Apple, iPhone, Extremely high frequency, 5G
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