Today, one of the most popular Weibo bloggers said that next year’s Qualcomm Snapdragon, HiSilicon Kirin, Samsung Exynos, and MediaTek Dimensity main flagship chips and mid-range chips will all adopt 1+3+4 architecture design.

As for Qualcomm, there have been a lot of reports. They claimed its upcoming flagship chip will use the ‘1+3+4’ octa-core design. Specifically, it will have one 2.84GHz ultra-large core Cortex X1, three 2.42GHz A78 cores, and four 1.8GHz A55s cores. From the previously leaked running score test, the Snapdragon 875 will still maintain the performance of the first echelon of Android SoC. As for the Snapdragon 885, we even have no imagination what features it will come with. So most likely, the blogger is talking about the Snapdragon 875. The chip is expected to be officially released on December 1.

As for HiSilicon, although it is not clear about the future scheduling and naming information, it is very likely that HiSilicon will continue to iteratively launch new Kirin chips, such as Kirin 10000. The manufacturing of finished products is not considered, and the architecture design should also belong to the first echelon level.

On Samsung’s side, the performance of the Exynos 2100 indicates that the chip may not necessarily lose to other products in the same period. Although most of the previous news was biased towards the Snapdragon 875 as the only product of this generation that adopted the ARM Cortex-X1 core, later reliable sources said that the Exynos 2100 will also use the ARM Cortex-X1 architecture. In addition, E2100 will also integrate an ARM Mali-G78 GPU with 14 graphics cores. So the performance is worth looking forward to.

Finally, as for MediaTek, there is still no news about the Dimensity 1000 series sequel. But no matter how it is changed, the performance and baseband of the Dimensity 1000 series are still top-level currently. Therefore, as long as MediaTek is iteratively updated step by step, the performance of its upcoming flagship chips will belong to the top level as well.

Shortly, there are four major players in the mobile platform market. And they all are going to adopt the newest technologies and make tough competition to each other. In this sense, the mobile SoC market segmentation will further change.

Back in 2010, he was dismissed from his position as a lecturer at the university. This made him get another job at his friend’s digital marketing company as a blog writer. After a few years, when he was thinking the article writing is his mission, Google pushed the Panda update and affected the company and websites he was working at. (Un)fortunately and surprisingly, he got an offer to head a large knitting factory. In 2016, he got his Ph.D. and resumed teaching at the University … and writing tech-related articles following his passion.

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HiSilicon, Exynos, Qualcomm Snapdragon, Huawei, 5 nm process, Chipset, MediaTek

World news – US – All Major Android SoC Manufacturers Will Use 1+3+4 Architecture Design

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